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Eddy current measurement of the thickness of top Cu film of the multilayer interconnects in the integrated

Zilian QU,Yonggang MENG,Qian ZHAO

Frontiers of Mechanical Engineering 2015, Volume 10, Issue 1,   Pages 1-6 doi: 10.1007/s11465-015-0325-2

Abstract: method, named equivalent unit method (EUM), for the thickness measurement of the top copper film of multilayer

Keywords： CMP     eddy current     multilayer wafer     Cu interconnects     equivalent unit    

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FEM-based strain analysis study for multilayer sheet forming process

Rongjing ZHANG,Lihui LANG,Rizwan ZAFAR

Frontiers of Mechanical Engineering 2015, Volume 10, Issue 4,   Pages 373-379 doi: 10.1007/s11465-015-0371-9

Abstract: the novel method, this study conducts a finite element method-based (FEM-based) strain analysis on multilayerHydroforming is used for multilayer forming.The results of this study will enhance the knowledge on the mechanics of multilayer structures formed

Keywords： finite element method (FEM)     strain analysis     multilayer sheet forming    

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Special issue: Technologies for future high-efficiency industrial silicon wafer solar cells

Frontiers in Energy 2017, Volume 11, Issue 1,   Pages 1-3 doi: 10.1007/s11708-016-0436-4

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Patterned wafer bonding using ultraviolet adhesive

Rui ZHUO, Guanglan LIAO, Wenliang LIU, Lei NIE, Tielin SHI

Frontiers of Mechanical Engineering 2011, Volume 6, Issue 2,   Pages 214-218 doi: 10.1007/s11465-011-0130-5

Abstract:

The process of patterned wafer bonding using ultraviolet (UV) adhesive as the intermediate layer wasExperimental results indicate that patterned wafer bonding using UV adhesive is achieved under room temperaturePatterned wafer bonding using UV adhesive will have great potential in the fabrication of microfluidic

Keywords： ultraviolet (UV) adhesive     intermediate layer     patterned wafer bonding    

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Mechanical properties and microstructure of multilayer graphene oxide cement mortar

Frontiers of Structural and Civil Engineering 2021, Volume 15, Issue 4,   Pages 1058-1070 doi: 10.1007/s11709-021-0747-3

Abstract: This study reports on the effects of multilayer graphene oxide (MGO) on compressive strength, flexural

Keywords： graphene oxide     cement     mortar     mechanical properties     microstructure    

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Experimental verification of the interface wave method to detect interlaminar damage of a metal multilayer

Bing LI,Xu GENG,Tong LU,Lei QIANG,Minghang LI

Frontiers of Mechanical Engineering 2015, Volume 10, Issue 4,   Pages 380-391 doi: 10.1007/s11465-015-0365-7

Abstract: (a type of interfacial wave between two solid half-spaces) is implemented to detect the damage in a multilayerTherefore, Stoneley waves show great potential as a non-destructive inspection method of a multilayer

Keywords： crack localization     interface waves     Stoneley waves     interlaminar damage     multilayer structure    

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Experimental research on the multilayer compartmental particle damper and its application methods on

Zhenyuan LUO, Weiming YAN, Weibing XU, Qinfei ZHENG, Baoshun WANG

Frontiers of Structural and Civil Engineering 2019, Volume 13, Issue 4,   Pages 751-766 doi: 10.1007/s11709-018-0509-z

Abstract: To introduce particle damping technology to long-period structure seismic control, a novel multilayer

Keywords： energy dissipation devices     multilayer compartmental particle damper     self-anchored suspension bridges    

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Modeling of coal swelling induced by water vapor adsorption

Zhejun PAN

Frontiers of Chemical Science and Engineering 2012, Volume 6, Issue 1,   Pages 94-103 doi: 10.1007/s11705-011-1172-2

Abstract: usually forms a single layer of adsorbed molecules, water vapor adsorption in the coal micropores forms multilayervapor adsorption-induced coal swelling, assuming that only the first layer of adsorbed molecules of the multilayer

Keywords： multilayer adsorption     vapour pressure     coal shrinkage     relative humidity     permeability    

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Effects of taping on grinding quality of silicon wafers in backgrinding

Zhigang DONG, Qian ZHANG, Haijun LIU, Renke KANG, Shang GAO

Frontiers of Mechanical Engineering 2021, Volume 16, Issue 3,   Pages 559-569 doi: 10.1007/s11465-020-0624-0

Abstract: Taping is often used to protect patterned wafers and reduce fragmentation during backgrinding of silicon wafers. Grinding experiments using coarse and fine resin-bond diamond grinding wheels were performed on silicon wafers with tapes of different thicknesses to investigate the effects of taping on peak-to-valley (PV), surface roughness, and subsurface damage of silicon wafers after grinding. Results showed that taping in backgrinding could provide effective protection for ground wafers from breakage. However, the PV value, surface roughness, and subsurface damage of silicon wafers with taping deteriorated compared with those without taping although the deterioration extents were very limited. The PV value of silicon wafers with taping decreased with increasing mesh size of the grinding wheel and the final thickness. The surface roughness and subsurface damage of silicon wafers with taping decreased with increasing mesh size of grinding wheel but was not affected by removal thickness. We hope the experimental finding could help fully understand the role of taping in backgrinding.

Keywords： taping     silicon wafer     backgrinding     subsurface damage     surface roughness    

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MEMS-based thermoelectric infrared sensors: A review

Dehui XU, Yuelin WANG, Bin XIONG, Tie LI

Frontiers of Mechanical Engineering 2017, Volume 12, Issue 4,   Pages 557-566 doi: 10.1007/s11465-017-0441-2

Abstract:

In the past decade, micro-electromechanical systems (MEMS)-based thermoelectric infrared (IR) sensors have received considerable attention because of the advances in micromachining technology. This paper presents a review of MEMS-based thermoelectric IR sensors. The first part describes the physics of the device and discusses the figures of merit. The second part discusses the sensing materials, thermal isolation microstructures, absorber designs, and packaging methods for these sensors and provides examples. Moreover, the status of sensor implementation technology is examined from a historical perspective by presenting findings from the early years to the most recent findings.

Keywords： thermoelectric infrared sensor     CMOS-MEMS     thermopile     micromachining     wafer-level package    

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Fabrication of Si-based three-dimensional microbatteries: A review

Chuang YUE, Jing LI, Liwei LIN

Frontiers of Mechanical Engineering 2017, Volume 12, Issue 4,   Pages 459-476 doi: 10.1007/s11465-017-0462-x

Abstract:

High-performance, Si-based three-dimensional (3D) microbattery systems for powering micro/nano-electromechanical systems and lab-on-chip smart electronic devices have attracted increasing research attention. These systems are characterized by compatible fabrication and integratibility resulting from the silicon-based technologies used in their production. The use of support substrates, electrodes or current collectors, electrolytes, and even batteries used in 3D layouts has become increasingly important in fabricating microbatteries with high energy, high power density, and wide-ranging applications. In this review, Si-based 3D microbatteries and related fabrication technologies, especially the production of micro-lithium ion batteries, are reviewed and discussed in detail in order to provide guidance for the design and fabrication.

Keywords： three-dimensional (3D)     wafer-scale     Si-based anode     micro-LIBs     thin-film deposition    

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A spectrally selective surface structure for combined photothermic conversion and radiative sky cooling

Bin ZHAO, Xianze AO, Nuo CHEN, Qingdong XUAN, Mingke HU, Gang PEI

Frontiers in Energy 2020, Volume 14, Issue 4,   Pages 882-888 doi: 10.1007/s11708-020-0694-z

Abstract: The sun and outer space are the ultimate heat and cold sources for the earth, respectively. They have significant potential for renewable energy harvesting. In this paper, a spectrally selective surface structure that has a planar polydimethylsiloxane layer covering a solar absorber is conceptually proposed and optically designed for the combination of photothermic conversion (PT) and nighttime radiative sky cooling (RC). An optical simulation is conducted whose result shows that the designed surface structure (i.e., PT-RC surface structure) has a strong solar absorption coefficient of 0.92 and simultaneously emits as a mid-infrared spectral-selective emitter with an average emissivity of 0.84 within the atmospheric window. A thermal analysis prediction reveals that the designed PT-RC surface structure can be heated to 79.1°C higher than the ambient temperature in the daytime and passively cooled below the ambient temperature of approximately 10°C in the nighttime, indicating that the designed PT-RC surface structure has the potential for integrated PT conversion and nighttime RC utilization.

Keywords： solar energy     photothermic conversion     radiative sky cooling     spectral selectivity     multilayer film    

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Progress and Prospect of Semiconductor Silicon Wafers in China

Zhang Guohu, Xiao Qinghua, Ma Fei

Strategic Study of CAE 2023, Volume 25, Issue 1,   Pages 68-78 doi: 10.15302/J-SSCAE-2023.01.002

Abstract: inch and 12-inch silicon wafers, analyzes the development status of the global semiconductor silicon waferThe study specifically focuses on the development status of China's semiconductor silicon wafer industryhoping to provide a reference for the higher-quality development of China’s semiconductor silicon wafer

Keywords： semiconductor silicon wafer     8 inches     12 inches     industry synergy     advanced processing    

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Ion conduction path in composite solid electrolytes for lithium metal batteries: from polymer rich to ceramic rich

Zhouyu ZHANG, Hao CHEN, Zhenglin HU, Shoubin ZHOU, Lan ZHANG, Jiayan LUO

Frontiers in Energy 2022, Volume 16, Issue 5,   Pages 706-733 doi: 10.1007/s11708-022-0833-9

Abstract: Solid-state electrolytes (SSEs) can address the safety issue of organic electrolyte in rechargeable lithium batteries. Unfortunately, neither polymer nor ceramic SSEs used alone can meet the demand although great progress has been made in the past few years. Composite solid electrolytes (CSEs) composed of flexible polymers and brittle but more conducting ceramics can take advantage of the individual system for solid-state lithium metal batteries (SSLMBs). CSEs can be largely divided into two categories by the mass fraction of the components: “polymer rich” (PR) and “ceramic rich” (CR) systems with different internal structures and electrochemical properties. This review provides a comprehensive and in-depth understanding of recent advances and limitations of both PR and CR electrolytes, with a special focus on the ion conduction path based on polymer-ceramic interaction mechanisms and structural designs of ceramic fillers/frameworks. In addition, it highlights the PR and CR which bring the leverage between the electrochemical property and the mechanical property. Moreover, it further prospects the possible route for future development of CSEs according to their rational design, which is expected to accelerate the practical application of SSLMBs.

Keywords： composite solid electrolytes     active filler/framework     ion conduction path     interphase compatibility     multilayer    

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Heterogeneous III-V silicon photonic integration: components and characterization Special Feature on Optoelectronic Devices and Inte

Shang-jian ZHANG, Yong LIU, Rong-guo LU, Bao SUN, Lian-shan YAN

Frontiers of Information Technology & Electronic Engineering 2019, Volume 20, Issue 4,   Pages 472-480 doi: 10.1631/FITEE.1800482

Abstract: We also describe the progress in the on-wafer characterization of photonic integration circuits, especially

Keywords： Heterogeneous photonic integration     Optical interconnection     On-wafer characterization    

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Title Author Date Type Operation

Eddy current measurement of the thickness of top Cu film of the multilayer interconnects in the integrated

Zilian QU,Yonggang MENG,Qian ZHAO

Journal Article

FEM-based strain analysis study for multilayer sheet forming process

Rongjing ZHANG,Lihui LANG,Rizwan ZAFAR

Journal Article

Special issue: Technologies for future high-efficiency industrial silicon wafer solar cells

Journal Article

Patterned wafer bonding using ultraviolet adhesive

Rui ZHUO, Guanglan LIAO, Wenliang LIU, Lei NIE, Tielin SHI

Journal Article

Mechanical properties and microstructure of multilayer graphene oxide cement mortar

Journal Article

Experimental verification of the interface wave method to detect interlaminar damage of a metal multilayer

Bing LI,Xu GENG,Tong LU,Lei QIANG,Minghang LI

Journal Article

Experimental research on the multilayer compartmental particle damper and its application methods on

Zhenyuan LUO, Weiming YAN, Weibing XU, Qinfei ZHENG, Baoshun WANG

Journal Article

Modeling of coal swelling induced by water vapor adsorption

Zhejun PAN

Journal Article

Effects of taping on grinding quality of silicon wafers in backgrinding

Zhigang DONG, Qian ZHANG, Haijun LIU, Renke KANG, Shang GAO

Journal Article

MEMS-based thermoelectric infrared sensors: A review

Dehui XU, Yuelin WANG, Bin XIONG, Tie LI

Journal Article

Fabrication of Si-based three-dimensional microbatteries: A review

Chuang YUE, Jing LI, Liwei LIN

Journal Article

A spectrally selective surface structure for combined photothermic conversion and radiative sky cooling

Bin ZHAO, Xianze AO, Nuo CHEN, Qingdong XUAN, Mingke HU, Gang PEI

Journal Article

Progress and Prospect of Semiconductor Silicon Wafers in China

Zhang Guohu, Xiao Qinghua, Ma Fei

Journal Article

Ion conduction path in composite solid electrolytes for lithium metal batteries: from polymer rich to ceramic rich

Zhouyu ZHANG, Hao CHEN, Zhenglin HU, Shoubin ZHOU, Lan ZHANG, Jiayan LUO

Journal Article

Heterogeneous III-V silicon photonic integration: components and characterization

Shang-jian ZHANG, Yong LIU, Rong-guo LU, Bao SUN, Lian-shan YAN

Journal Article